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21st International Symposium on Chemical-Mechanical Planarization

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CMP Meeting 2017 Presentations (Password required)


Sunday, August 13:

12:00 - 5:00 P.M.  Hotel and CAMP Registration

 5:45 - 7:15 P.M.  Cocktail Reception, (No formal dinner provided) 


Monday, August 14:

 7:00- 8:10 AM  Breakfast

Session I

8:00 A.M.  S.V. Babu: Opening Remarks

8:05 A.M.  Cherishing Old Knowledge, Acquiring New --  Manabu Tsujimura (EBARA Corporation)

8:30 A.M.  Polishing Anything with Everything: Common Material Science Themes in the CMP of Uncommon Materials -- Lee Cook (Recursive Systems LLC) 

8:55 A.M.  Middle of Line CMP: Stop-on-Selectivity -- Stan Tsai (GlobalFoundries/IBM)

9:20 A.M.  Cobalt CMP Development for Advanced Logic Devices -- Changhong Wu (GlobalFoundries)

9:45 A.M.  Coffee Break       

Session II  

10:10 A.M.  Use of imec's CMP Test Mask for Process Development in FEOL, MOL and  BEOL - Description of test cases in STI/Fin CMP and Co CMP --  Katia Devriendt (IMEC)

10:35 A.M.  Effect of Process Variations on Interconnects Performance in Advance Semiconductor Manufacturing Nodes --  Prasad Bhosale  (IBM, Albany)

11:00 A.M.  Cobalt Metallization in MOL Contacts and Related Challenges -- Vimal Kamineni (GlobalFoundries/IBM)

11:25 A.M.  A Closer Look at Defectivity and Defect Types at Advanced (≤16nm) Device Nodes Following Post-CMP Cleaning -- Paul Bernatis (DuPont)

11:50 A.M.  14nm FinFET Cleaning Technology  --Youngki Ahn (Daelim University)

12:15 P.M.  Lunch 

Session III           

3:45 P.M.  Using Process Control to Address Challenges in Consistent Cleaning Forces Over Brush Lifetime – Jaimie Stomberg  (Applied Materials)

4:10 P.M.  Effects of Back Surface Polishing of Silicon Wafer on Lithography Process -- Yukiteru Matsui (Toshiba Memory Corporation)

4:35 P.M.  Post-Oxide CMP Defects Improvement -- Jimmy Granstrom and Hisashi Takeda (Fujimi Co.) 

5:00 P.M.  Monitoring of Pad Surface Using the Optical Sensor during CMP Process -- Taesung Kim (Sungkyunkwan University)

5:25 P.M.  Skin Layer Effect on a PVA Brush Friction -- Toshiyuki Sanada (Shizuoka University)

5:50 -7:00 P.M.   Poster Session / Open Bar

7:00 P.M.  Dinner - After Dinner Speaker: Semiconductors: The Industry Which Change the World, Jason Mazzotti, Direc tor of Deposition ETCH & CMP(GlobalFoundries)  


Tuesday, August 15:

7:00 - 8:00 A.M. Breakfast

Session IV          

8:00 A.M.   Dynamic Pad Measurement and Monitoring for CMP Pad Performance Index -- C-C Arthur Chen (National Taiwan University of Science & Technology)

8:25 A.M.   Characteriztion of Pad Surfaces for Investigating Conditioner Performance in Dielectric CMP Process Development of 5-7 nm nodes -- Mayu Yamamura (Applied Materials)

8:50 A.M.   CVD-Coated Conditioning Disc Designs and Their Effect on Pad Surface Micro-Texture and Copper CMP Performance --Ara Philipossian (U. Arizona)

9:15 A.M.   Structures of Cu Surfaces Developing in Benzotriazole Solutions - Effect of pH -- Eiichi  doh (University of Yamanashi)

9:40 A.M.   Qualitative and quantitative characterization of Cu complex layer in Cu CMP -- Jingoo Park (Hanyang University)

10:05 A.M.   Coffee Break

Session V              

10:30 A.M.   Surface Chemistry of Ceria Nanoparticles for CMP Applications -- Jihoon Seo (Clarkson University)

10:55 A.M.   Investigation of Polisher Defect Generation Mechanism by Predictable Process Conditions -- Ji Chul Yang (GlobalFoundries)

11:20 A.M.   Defects Improvement by the Advanced CMP Slurry -- Yoshihiro Izawa1; Toshio Shinoda1, Masaki Tada1, Naoyuki Ishihara1, Tomohiko Akatuska1, and Hisashi Takeda (1- Fujimi Inc; 2 Fujimi Co.)

11:45 A.M.   Neutral Beam Technology for Nano-Materials and Nano-Devices -- Seiji Samukawa (Tohoku University)

12:10   P.M.   Lunch - Remarks by Tony Collins, Clarkson University President

Session VI            

3:45 P.M.   Real Time Process Monitoring with LKPrime and HPPC Hardware Capabilities for Advanced Nodes -- Venkat Hariharan (Applied Materials)

4:10 P.M   Characteristics of Wafer Cleaning by Liquid Flow  -- Satomi Hamada (Ebara Corporation)

4:35 P.M.   Defects and Their Formation Mechanism in Middle Of Line (MOL) Tungsten CMP Process, Hong Jin Kim (GlobalFoundries)

 5:00 P.M.   Sputtered TMDC 2D Materials and their Electrical Properties -- Hitoshi Wakabayashi (Tokyo Institute of Technology)

5:25 P.M.   A Ring Shape Copper Oxide Formation During Post Cu CMP Cleaning -- Hojoong Kim (Samsung Electronics)

6:15 - 6:30 P.M.   Travel to Golf Club 

6:30 - 7:15 P.M.   Reception

7:15 P.M.   Dinner - After Dinner Speaker: MATERIALS ENGINEERING: The Foundation of Innovation for the Future -- Nag Patibandla, VP, Advanced Deposition Products; Office of the CTO, Applied Materials, Inc. 


Wednesday, August 16:

7:00 - 8:00 A.M.  Breakfast

Session VII          

8:05 A.M.   Planarization of Silicon Carbide Wafer Using Catalyst-Referred Etching -- Yasuhisa Sano (Osaka University)

8:30 A.M.   Advanced Nanoceria for STI Polishing Applications -- Nate D. Urban, Peter M. Marley and Robert Her, (Ferro Corporation)

8:55 A.M.   Studying Large Particle Contaminants in Various Nanoparticle Chemical Mechanical Planarization Slurries with Holographic Particle Characterization -- Fook C. Cheong, Priya Kasimbeg, and Laura A. Phillips (Spheryx Solutions)

9:20 A.M.   Within-wafer and Within-die Nanotopography Challenges and Characterization for Advanced Logics -- Wei Tsu Tseng (GlobalFoundries)

9:45 A.M.   Proposal of Optical Measurement Method for 3D Single Nanoparticle Position Near a Surface -- Panart Khajornrungruang (Kyushu Institute of Technology)

Session VIII         

10:10 A.M.   Coffee Break

10:35 A.M.   Electrochemical Study of Germanium and Its Application in CMP -- Baoguo Zhang (Hebei Institute of Technology)

11:00 A.M.   Challenges and Solutions for Post-CMP Cleaning of Dielectric Surfaces Contaminated with Ceria Nanoparticles – Mechanistic Aspects of Bond Breaking and Particle-Substrate Interfacial Interactions -- Daniela White (Entegris)

11:25 A.M.   CMP of Low Modulus Films for Next Generation Devices -- Josiah Jebaraj (Micron)

11:50 A.M.   Wafer Cleaning Challenges -- Uma Lagudu (Micron)

12:15 P.M.   Closing Remarks, S.V. Babu, CAMP

12:20 P.M.   Lunch  


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